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DES Document 59-v1

Procedure for Unpacking Sensors from LBNL

Document #:
DES-doc-59-v1
Document type:
Technical Note
Submitted by:
Greg Derylo
Updated by:
Greg Derylo
Document Created:
07 Mar 2006, 13:14
Contents Revised:
07 Mar 2006, 13:14
Metadata Revised:
07 Mar 2006, 13:14
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Abstract:
This procedure describes the steps involved in removing sensors from the wafer dicing tape and for visually scanning the surface. The photo shows the vacuum blocks used to pull the 2x4 and 2x2 sensors off the tape. These blocks are about 1/4" larger than the footprint of the sensors.
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